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Auteur Mahdi Nikdast |
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Titre : Silicon photonics for high-performance computing and beyond Type de document : texte imprimé Auteurs : Mahdi Nikdast, Auteur Mention d'édition : First édition Editeur : Taylor Francis Group Année de publication : 2022 Importance : 265 P Format : 25 x 17 cm ISBN/ISSN/EAN : 978-0-367-26214-3 Langues : Anglais (eng) Langues originales : Anglais (eng) Index. décimale : 621 Note de contenu : Contents.
Section 1. High-performance computing interconnect requirements and avances.
Chapter 1. Silicon photonic modulation for high-performance computing.P3
Chapter 2. Laser modulation schemes for minimizing static power dissipation.P23
Chapter 3. Scalable low-power high-performance optical network for rack-scale computers.P41
Chapter 4. Network-in- package for low-power and high-performance computing.P57
Section 2. Device-and system-level challenges and improvements.
Chapter 5. System-level management of silicon-photonic networks in 2.5 D systems.P71
Chapter 6. Thermal reliability and communication performance co-optimization for WDM-based optical networks-on chip.P89
Chapter 7. Exploring aging effects in photonic interconnects for high-performance manycore architectures.P113
Section 3. Novel design solutions and automation.
Section 4. Novel materials . Devices . and photonic integrated circuits.
Section 5. Emerging computing technologies and applications.
Index.P383Silicon photonics for high-performance computing and beyond [texte imprimé] / Mahdi Nikdast, Auteur . - First édition . - [S.l.] : Taylor Francis Group, 2022 . - 265 P ; 25 x 17 cm.
ISBN : 978-0-367-26214-3
Langues : Anglais (eng) Langues originales : Anglais (eng)
Index. décimale : 621 Note de contenu : Contents.
Section 1. High-performance computing interconnect requirements and avances.
Chapter 1. Silicon photonic modulation for high-performance computing.P3
Chapter 2. Laser modulation schemes for minimizing static power dissipation.P23
Chapter 3. Scalable low-power high-performance optical network for rack-scale computers.P41
Chapter 4. Network-in- package for low-power and high-performance computing.P57
Section 2. Device-and system-level challenges and improvements.
Chapter 5. System-level management of silicon-photonic networks in 2.5 D systems.P71
Chapter 6. Thermal reliability and communication performance co-optimization for WDM-based optical networks-on chip.P89
Chapter 7. Exploring aging effects in photonic interconnects for high-performance manycore architectures.P113
Section 3. Novel design solutions and automation.
Section 4. Novel materials . Devices . and photonic integrated circuits.
Section 5. Emerging computing technologies and applications.
Index.P383Réservation
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