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Semiconductor Memories / Ashok K.sharma
Titre : Semiconductor Memories : Technology,testing and reliability Type de document : texte imprimé Auteurs : Ashok K.sharma, Editeur : New delhi : Prentice hall of india Année de publication : 1997 Importance : 462 p Présentation : couv.illi.fig.ind.bib Format : 23×17.5 cm ISBN/ISSN/EAN : 978-81-203-1683-6 Langues : Anglais (eng) Langues originales : Anglais (eng) Index. décimale : 621 Physique appliquée Résumé :
This compact book provides a comprehensive and integrated coverage of three areas of semiconductor memories: technology, testing, and reliability. It gives state-of-the-art information on semiconductor memory technology for both volatile random access memories (RAMs) and nonvolatile memories such as read-only memories (ROMs), programmable read-only memories (PROMs), and erasable and programmable read-only memories (EPROMs). It focusses the reader's attention on such areas as design for testing, fault tolerance, failure modes and mechanisms, and screening and qualification methods.The book should be useful to a broad spectrum of people in the semiconductor manufacturing and electronics industries, including engineers, system level designers, and managers in the computer, telecommunication, automotive, commercial satellite and military avionics areas as well as students pursuing these areas……
Note de contenu :
Chapter 1: Introduction. Chapter 2: Random Access Memory Technologies. 2.1 Introduction. 2.2 Static Random Access Memories (SRAMs). 2.3 Dynamic Random Access Memories (DRAMs). Chapter 3: Nonvolatile Memories. 3.1 Introduction. 3.2 Masked Read-Only Memories (ROMs). 3.3 Programmable Read-Only Memories (PROMs). 3.4 Erasable (UV)-Programmable Read-Only Memories (EPROMs). 3.5 Electrically Erasable PROMs (EEPROMs). 3.6 Flash Memories (EPROMs or EEPROMs). Chapter 4: Memory Fault Modeling and Testing. 4.1 Introduction . . . . 4.2 RAM Fault Modeling. 4.3 RAM Electrical Testing. 4.4 RAM Pseudorandom Testing. 4.5 Megabit DRAM Testing. 4.6 Nonvolatile Memory Modeling and Testing. 4.7 IDDQ Fault Modeling and Testing. 4.8 Application Specific Memory Testing. Chapter 5: Memory Design for Testability and FaultTolerance. 5.1 General Design for Testability Techniques. 5.2 RAM Built-in Self-Test (BIST). 5.3 Embedded Memory DFT and BIST Techniques. 5.4 Advanced BIST and Built-in Self-Repair Architectures. 5.5 DFT and BIST for ROMs. 5.6 Memory Error-Detection and Correction Techniques. 5.7 Memory Fault-Tolerance Designs. Chapter 6: Semiconductor Memory Reliability. 6.1 General Reliability Issues. 6.2 RAM Failure Modes and Mechanisms. 6.3 Nonvolatile Memory Reliability. 6.4 Reliability Modeling and Failure Rate Prediction. 6.5 Design for Reliability. 6.6 Reliability Test Structures. 6.7 Reliability Screening and Qualification. Chapter 7: Semiconductor Memory Radiation Effects. 7.1 Introduction. 7.2 Radiation Effects. 7.3 Radiation-Hardening Techniques. 7.4 Radiation Hardness Assurance and Testing. Chapter 8: Advanced Memory Technologies. 8.1 Introduction. 8.2 Ferroelectric Random Access Memories (FRAMs). 8.3 Gallium Arsenide (GaAs) FRAMs. 8.4 Analog Memories. 8.5 Magnetoresistive Random Access Memories (MRAMs). 8.6 Experimental Memory Devices. Chapter 9: High-Density Memory PackagingTechnologies. 9.1 Introduction. 9.2 Memory Hybrids and MCMs (2-D). 9.3 Memory Stacks and MCMs (3-D). 9.4 Memory MCM Testing and Reliability Issues. 9.5 Memory Cards. 9.6 High-Density Memory Packaging Future Directions. Index.
Semiconductor Memories : Technology,testing and reliability [texte imprimé] / Ashok K.sharma, . - New delhi : Prentice hall of india, 1997 . - 462 p : couv.illi.fig.ind.bib ; 23×17.5 cm.
ISBN : 978-81-203-1683-6
Langues : Anglais (eng) Langues originales : Anglais (eng)
Index. décimale : 621 Physique appliquée Résumé :
This compact book provides a comprehensive and integrated coverage of three areas of semiconductor memories: technology, testing, and reliability. It gives state-of-the-art information on semiconductor memory technology for both volatile random access memories (RAMs) and nonvolatile memories such as read-only memories (ROMs), programmable read-only memories (PROMs), and erasable and programmable read-only memories (EPROMs). It focusses the reader's attention on such areas as design for testing, fault tolerance, failure modes and mechanisms, and screening and qualification methods.The book should be useful to a broad spectrum of people in the semiconductor manufacturing and electronics industries, including engineers, system level designers, and managers in the computer, telecommunication, automotive, commercial satellite and military avionics areas as well as students pursuing these areas……
Note de contenu :
Chapter 1: Introduction. Chapter 2: Random Access Memory Technologies. 2.1 Introduction. 2.2 Static Random Access Memories (SRAMs). 2.3 Dynamic Random Access Memories (DRAMs). Chapter 3: Nonvolatile Memories. 3.1 Introduction. 3.2 Masked Read-Only Memories (ROMs). 3.3 Programmable Read-Only Memories (PROMs). 3.4 Erasable (UV)-Programmable Read-Only Memories (EPROMs). 3.5 Electrically Erasable PROMs (EEPROMs). 3.6 Flash Memories (EPROMs or EEPROMs). Chapter 4: Memory Fault Modeling and Testing. 4.1 Introduction . . . . 4.2 RAM Fault Modeling. 4.3 RAM Electrical Testing. 4.4 RAM Pseudorandom Testing. 4.5 Megabit DRAM Testing. 4.6 Nonvolatile Memory Modeling and Testing. 4.7 IDDQ Fault Modeling and Testing. 4.8 Application Specific Memory Testing. Chapter 5: Memory Design for Testability and FaultTolerance. 5.1 General Design for Testability Techniques. 5.2 RAM Built-in Self-Test (BIST). 5.3 Embedded Memory DFT and BIST Techniques. 5.4 Advanced BIST and Built-in Self-Repair Architectures. 5.5 DFT and BIST for ROMs. 5.6 Memory Error-Detection and Correction Techniques. 5.7 Memory Fault-Tolerance Designs. Chapter 6: Semiconductor Memory Reliability. 6.1 General Reliability Issues. 6.2 RAM Failure Modes and Mechanisms. 6.3 Nonvolatile Memory Reliability. 6.4 Reliability Modeling and Failure Rate Prediction. 6.5 Design for Reliability. 6.6 Reliability Test Structures. 6.7 Reliability Screening and Qualification. Chapter 7: Semiconductor Memory Radiation Effects. 7.1 Introduction. 7.2 Radiation Effects. 7.3 Radiation-Hardening Techniques. 7.4 Radiation Hardness Assurance and Testing. Chapter 8: Advanced Memory Technologies. 8.1 Introduction. 8.2 Ferroelectric Random Access Memories (FRAMs). 8.3 Gallium Arsenide (GaAs) FRAMs. 8.4 Analog Memories. 8.5 Magnetoresistive Random Access Memories (MRAMs). 8.6 Experimental Memory Devices. Chapter 9: High-Density Memory PackagingTechnologies. 9.1 Introduction. 9.2 Memory Hybrids and MCMs (2-D). 9.3 Memory Stacks and MCMs (3-D). 9.4 Memory MCM Testing and Reliability Issues. 9.5 Memory Cards. 9.6 High-Density Memory Packaging Future Directions. Index.
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